Products

MTI

Copper Foil for Battery Anode Substrate w/ Double Side Coated by Conductive Carbon (180mm/280mm width x 13 um thick, 1.3 kg/roll) - EQ-CC-Cu-20

MTI

Copper Foil with 25 um Thickness and 150 mm Width for Epitaxial Growth of Two Dimensional Materials, BCCF-25u

MTI

Copper Foil with Various Width and Thickness as Battery Current Collector : from 4.5m, to 25m

MTI

Copper gasket for threaded joint (1/4BSPP) - EQ-ORing-Cu11

MTI

Copper Mesh Foil for Battery Anode Substrate (240mm width x 45um thickness x 20 Meter length) - MF-Cu45-net

MTI

Copper Mesh Foil for Battery Anode Substrate (290mm width x 11um thickness x 80 Meter length) - MF-Cu11D25-net

MTI

Copper Vacuum Casting Mold

MTI

Copper Welding Electrodes for Spot Welder Machine - EQ-LiB-AWE

BASi Inc.

Copper/Copper Sulfate Reference Electrode

MTI

Corning EAGLE XG Glass Substrates 10 mm x 10 mm x 0.7 mm - CorningEagle101007S2opt

MTI

Corning EAGLE XG Glass Substrates 100mm x 100 mm x 0.7 mm

MTI

Corning EAGLE XG Glass Substrates 25 mm x 75mm x 0.7 mm, (10 pcs/pack)

MTI

Corning EAGLE XG Glass Substrates 25.4 mm x 25.4 mm x 0.7 mm - CorningEagle252507S2opt

MTI

Corning EAGLE XG Glass Substrates 25.4 mm x 25.4 mm x 1.1 mm,( 10 pcs /pack)

MTI

Corning EAGLE XG Glass Substrates 25.4 mm x 76.2 mm x 1.1 mm,( 10 pcs /pack)

MTI

Corning EAGLE XG wafer 100mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle100D05C2opt

MTI

Corning EAGLE XG wafer 150mm dia x 1.1 mm, 2 sp surface quality 60/40 - CorningEagle150D11C2opt

MTI

Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt

MTI

Corning EAGLE XG wafer 76.2mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle76D05C2opt

MTI

Corning Willow Glass 100mm dia x 0.2mm, 2 sp surface quality 60/40,10 pcs/pack - CorningWillow100D02C2opt