Silica on Silicon(Thermal Oxide Wafer)

MTI

Thermal Oxide Wafer: 100 nm SiO2 Layer on Si (100), 4"dia x 0.525 mm , N type , P doped, 1SP R: 0.1-1.0ohm.cm - Fm100SOonSIPa100D0525C1R01US

MTI

Thermal Oxide Wafer: 100 nm SiO2 Layer on Si (100), 4"dia x 0.50 mm t, P-type ,B-doped 1SP R:1-10 ohm.cm

MTI

Thermal Oxide Wafer, 30 nm SiO2 Layer on Si (100), 2" dia x 0.50 mm t, N type, As-doped, 1 side polished, R:<0.005 ohm.cm

MTI

Thermal Oxide Wafer:300nm SiO2 Layer on Si (100)100mm diax0.5 mm t,P type, 1SP R:0.001-0.005 ohm.cm

MTI

Thermal Oxide Wafer: One side 300 nm SiO2 Layer on Si (100), 4"dia x 0.50 mm t,undoped N type, 1SP R:>5000 ohm.cm