Multi-Blade Low Speed Saw with 6" Cutting Blade for Dicing 4" Wafer - SYJ190
Delivery and Shipping to EU
Delivery and Shipping to EU
We will add in the quotation, the shipping, insurance, customs clearance costs.
Multi-Blade Low Speed Saw with 6" Cutting Blade for Dicing 4" Wafer - SYJ190
MTI
SYJ190 is a multi-blade diamond low-speed precision saw designed for dicing up to 4’ wafer samples. The equipment supports the installation of multiple cutting blades, enabling a wide range of sample materials.
The machine is equipped with a 2D tiltable and adjustable positioning stage and a digital micrometer for accurate sample alignment and positioning. During the operation, a cooling fluid system is applied to dissipate heat generated during the cutting process to minimize thermal damage of the sample.
SPECIFICATION:
| Voltage and Power |
|
| Speed Range |
|
| Cutting Width & Depth |
|
| Blades |
|
| Accessories |
|
| Certification |
|
| Application Note |
|
| Warning |
|




